IEEE EPS Summer School 2026-SEKU

Jul 14

South Eastern Kenya University Starts on Tue, Jul 14 08:00 AM 3w 3d

South Eastern Kenya University

Tue, Jul 14 08:00 AM - Wed, Jul 15 11:45 PM

days

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Select Tickets

IEEE EPS Student members - KES 500.00
IEEE EPS Student members

IEEE Student members - KES 1,000.00
IEEE Student members not part of EPS society

IEEE Professional members - KES 1,500.00
IEEE Professional members

Non IEEE Members - KES 2,500.00
Non IEEE members

No. of Tickets*

Theme: "Foundations of High-Density PCB Design: A Stepping Stone to Advanced Electronics Packaging."

PCB design underpins all advanced electronics packaging, yet most Sub-Saharan African graduates lack

practical exposure. This program uses a stepping-stone pedagogy: foundational PCB theory progressing to four

EPS pillars:

• High-Density Interconnects (HDI): Via-in-pad, blind/buried via topologies, and micro-via design rules.

• Signal & Power Integrity (SI/PI): Controlled impedance routing, differential pairs, and decoupling

strategies.

• Thermal Management: Copper pours, thermal via arrays, and simulation-driven heat-path optimization.

• Design for Manufacturing (DFM) via KiCad: Gerber generation, DRC, and fab-house coordinat